Figure 1.
Flow diagram for the analysis of theoretical thermal dissipation. Source: our own elaboration.
Figure 1.
Flow diagram for the analysis of theoretical thermal dissipation. Source: our own elaboration.
Figure 2.
Modelling in 3D of the luminaire Model. Source: our own elaboration.
Figure 2.
Modelling in 3D of the luminaire Model. Source: our own elaboration.
Figure 3.
Definition of skew. Source: HyperMesh meshing control guide.
Figure 3.
Definition of skew. Source: HyperMesh meshing control guide.
Figure 4.
Mesh control. Source: HyperMesh meshing control guide.
Figure 4.
Mesh control. Source: HyperMesh meshing control guide.
Figure 5.
Discretized luminaire Model. Source: our own elaboration from the software HyperMesh.
Figure 5.
Discretized luminaire Model. Source: our own elaboration from the software HyperMesh.
Figure 6.
Discretized PCB and LED diode. Source: our own elaboration from the software HyperMesh.
Figure 6.
Discretized PCB and LED diode. Source: our own elaboration from the software HyperMesh.
Figure 7.
Average section of the components and air generated with tetrahedral Model. Source: our own elaboration from the software HyperMesh.
Figure 7.
Average section of the components and air generated with tetrahedral Model. Source: our own elaboration from the software HyperMesh.
Figure 8.
Temperature medium section of the luminaire at 20 °C. Source: HyperView software.
Figure 8.
Temperature medium section of the luminaire at 20 °C. Source: HyperView software.
Figure 9.
Speed section medium of the luminaire at 20 °C. Source: HyperView software.
Figure 9.
Speed section medium of the luminaire at 20 °C. Source: HyperView software.
Figure 10.
Temperature medium section of the luminaire at 40 °C. Source: HyperView software.
Figure 10.
Temperature medium section of the luminaire at 40 °C. Source: HyperView software.
Figure 11.
Speed section media of the luminaire at 40 °C. Source: HyperView software.
Figure 11.
Speed section media of the luminaire at 40 °C. Source: HyperView software.
Figure 12.
Temperature medium section of the luminaire at −10 °C. Source: HyperView software.
Figure 12.
Temperature medium section of the luminaire at −10 °C. Source: HyperView software.
Figure 13.
Speed section medium of the luminaire at −10 °C. Source: HyperView software.
Figure 13.
Speed section medium of the luminaire at −10 °C. Source: HyperView software.
Figure 14.
Temperature range of the complete luminaire and of the drivers base with respect to the ambient temperature in each simulation. Source: our own elaboration.
Figure 14.
Temperature range of the complete luminaire and of the drivers base with respect to the ambient temperature in each simulation. Source: our own elaboration.
Figure 15.
Temperature range of the complete luminaire (a) and of the drivers base (b) with respect to the ambient temperature in each simulation. Source: our own elaboration.
Figure 15.
Temperature range of the complete luminaire (a) and of the drivers base (b) with respect to the ambient temperature in each simulation. Source: our own elaboration.
Figure 16.
Comparison of dissipation of the diffuser (left) and of the heatsink (right) for different simulation temperatures. Source: our own elaboration from the software HyperView.
Figure 16.
Comparison of dissipation of the diffuser (left) and of the heatsink (right) for different simulation temperatures. Source: our own elaboration from the software HyperView.
Figure 17.
Temperature range of the diffuser (a) and the dissipater or heatsink (b) with respect to the ambient temperature in each simulation of the Model. Source: our own calculations.
Figure 17.
Temperature range of the diffuser (a) and the dissipater or heatsink (b) with respect to the ambient temperature in each simulation of the Model. Source: our own calculations.
Figure 18.
Luminaire Model. LED Air Series 7 of ATP Lighting. Source: ATP LED catalog lighting.
Figure 18.
Luminaire Model. LED Air Series 7 of ATP Lighting. Source: ATP LED catalog lighting.
Figure 19.
Thermal data of the cover. Blue and green area. Plastic emissivity 0.92. Source: Software SmartView 4.1 Fluke.
Figure 19.
Thermal data of the cover. Blue and green area. Plastic emissivity 0.92. Source: Software SmartView 4.1 Fluke.
Figure 20.
Thermal data of the heatsink. Reddish area: emissivity aluminum alloy 0.5. Source: Software SmartView 4.1 Fluke.
Figure 20.
Thermal data of the heatsink. Reddish area: emissivity aluminum alloy 0.5. Source: Software SmartView 4.1 Fluke.
Figure 21.
Thermal data of the heatsink. Reddish area: emissivity aluminum alloy 0.5. Source: Software SmartView 4.1 Fluke.
Figure 21.
Thermal data of the heatsink. Reddish area: emissivity aluminum alloy 0.5. Source: Software SmartView 4.1 Fluke.
Figure 22.
Thermal data of the diffuser. Green zone: plastic emissivity 0.92. Source: Software SmartView 4.1 Fluke.
Figure 22.
Thermal data of the diffuser. Green zone: plastic emissivity 0.92. Source: Software SmartView 4.1 Fluke.
Figure 23.
Summary of the joining temperatures of LEDs during the simulation at ambient temperature of 40 °C. Source: our own elaboration.
Figure 23.
Summary of the joining temperatures of LEDs during the simulation at ambient temperature of 40 °C. Source: our own elaboration.
Figure 24.
Variation of the maximum junction temperature of the LEDs with respect to the ambient temperature of the simulation, marking the limit junction temperature of each LED. Source: our own elaboration.
Figure 24.
Variation of the maximum junction temperature of the LEDs with respect to the ambient temperature of the simulation, marking the limit junction temperature of each LED. Source: our own elaboration.
Figure 25.
Junction temperature of LEDs (Tj) vs. luminous flux. Source: our own elaboration and data sheet LED Osram LUW CQAR (streetwhite).
Figure 25.
Junction temperature of LEDs (Tj) vs. luminous flux. Source: our own elaboration and data sheet LED Osram LUW CQAR (streetwhite).
Figure 26.
Junction temperature (Tj) vs. change of chromaticity coordinates. Source: our own elaboration and data sheet LED Osram LUW CQAR (streetwhite).
Figure 26.
Junction temperature (Tj) vs. change of chromaticity coordinates. Source: our own elaboration and data sheet LED Osram LUW CQAR (streetwhite).
Figure 27.
Comparative theoretical data (left) and experimental data (right). Source: our own elaboration from the software HyperView and SmartView 4.1.
Figure 27.
Comparative theoretical data (left) and experimental data (right). Source: our own elaboration from the software HyperView and SmartView 4.1.
Table 1.
Components, materials and powers. Source: ATP lighting S.A.
Table 1.
Components, materials and powers. Source: ATP lighting S.A.
Components | Subcomponent | Part | Material | Information |
---|
Cover | - | - | PC | Opaque |
Heatsink | - | - | Aluminum | Confidential |
Equipment carrier | - | - | PA66–30FV | - |
Equipment | - | - | PA66–30FV | - |
Drivers | | Microchips | Silicon | 2 drivers; 6 W/driver |
PCB driver | Welding | Tin |
| Base | Aluminum |
Housing | - | PC |
Diffuser | - | - | PC | Transparent |
Chassis | - | - | PA66–30FV | - |
PCB LED | - | - | Aluminum | - |
LED | - | - | Copper/Material Rth | 96 LED; 2 W/LED |
Table 2.
Properties of the materials of the model. Source: commercial catalogs of the manufacturer’s Model (ATP).
Table 2.
Properties of the materials of the model. Source: commercial catalogs of the manufacturer’s Model (ATP).
Material | Density kg/m3 | Specific Heat J/kg·K | Thermal Conductivity W/m·K |
---|
Aluminum | 2750 | 961 | 200 |
Silicon | 2330 | 700 | 148 |
Tin | 7365 | 228 | 66.6 |
PA66–30FV | 1370 | 2290 | 0.29 |
PC | 1200 | 1250 | 0.19 |
Copper | 8900 | 394 | 387 |
Material Rth | 3300 | 780 | 52.91 |
Table 3.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at 20 °C. Source: our own elaboration.
Table 3.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at 20 °C. Source: our own elaboration.
Component | Material | Maximum Limit Temperature (°C) | Temperature Measured (°C) |
---|
Cover | PC | 145 | 70 |
Heatsink | Aluminum | 460 | 112 |
Equipment carrier | PA66–30FV | 150 | 77 |
Equipment | PA66–30FV | 150 | 112 |
Drivers Bases | Aluminum | 460 | 112 |
Driver (Electronic) | Silicon (Weakest) | 150 | 105 |
Diffuser | PC | 145 | 100 |
Chassis | PA66–30FV | 150 | 107 |
PCB | Aluminum | 460 | 117 |
Table 4.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at 40 °C. Source: our own elaboration.
Table 4.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at 40 °C. Source: our own elaboration.
Component | Material | Maximum Limit Temperature (°C) | Temperature Measured (°C) |
---|
Cover | PC | 145 | 90 |
Heatsink | Aluminum | 460 | 131 |
Equipment carrier | PA66–30FV | 150 | 97 |
Equipment | PA66–30FV | 150 | 129 |
Drivers Bases | Aluminum | 460 | 130 |
Driver (Electronic) | Silicon (Weakest) | 150 | 130 |
Diffuser | PC | 145 | 118 |
Chassis | PA66–30FV | 150 | 123 |
PCB | Aluminum | 460 | 137 |
Table 5.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at −10 °C. Source: our own elaboration.
Table 5.
Maximum temperature limit of the material versus temperature measured in the different parts of the Model at −10 °C. Source: our own elaboration.
Component | Material | Maximum Limit Temperature (°C) | Temperature Measured (°C) |
---|
Cover | PC | 145 | 42 |
Heatsink | Aluminum | 460 | 82 |
Equipment carrier | PA66–30FV | 150 | 47 |
Equipment | PA66–30FV | 150 | 83 |
Drivers Bases | Aluminum | 460 | 84 |
Driver (Electronic) | Silicon (Weakest) | 150 | 90 |
Diffuser | PC | 145 | 69 |
Chassis | PA66–30FV | 150 | 74 |
PCB | Aluminum | 460 | 88 |
Table 6.
Luminaire power table. Source: manufacturer’s data.
Table 6.
Luminaire power table. Source: manufacturer’s data.
Model | Nominal Power (W) | Number of LEDs | Power by LED (W/LED) | Power DRIVER (W) |
---|
ATP Aire Serie 7 | 204 | 96 | 2 | 12 (6 W/driver) |
Table 7.
Driver features. Source: manufacturer’s data.
Table 7.
Driver features. Source: manufacturer’s data.
Model | Efficiency (%) | Nominal Power (W) | Operating Input Range (V) | Storage Temperature (°C) | Output Current (A) |
---|
MP4688 | 95 | 2–2.5 | 4.5–80 | −65 to 150 | Up to 1 A |
Table 8.
Table of specifications of the thermal imager. Source: the user’s manual of the Ti 25 FLUKE thermal camera.
Table 8.
Table of specifications of the thermal imager. Source: the user’s manual of the Ti 25 FLUKE thermal camera.
Attribute | Value |
---|
Thermal sensitivity | ≤90 mK |
Temperature Measurement Range | −20 → +350 °C |
Maximum Accuracy of Temperature Measurement | ±2 °C |
Field of vision H × V | 23 × 17° |
Update frequency | 9 Hz |
Minimum Focus Distance | 15 (Thermal Lens) cm, 46 (Visual Lens) cm |
Type of Focus | Manual |
Detector Resolution | 160 × 120 pixel |
Display size | 3.7 plg |
Display Resolution | 640 × 480 pixel |
Model number | Ti25 |
Table 9.
Junction temperatures of the LEDs obtained in the simulations (Tj). Source: our own elaboration.
Table 9.
Junction temperatures of the LEDs obtained in the simulations (Tj). Source: our own elaboration.
| External Ambient Temperature of the Simulation (°C) | Junction Temperature of the LEDs Tj (°C) |
---|
Temperature 1 | 40 | 135 |
Temperature 2 | 20 | 117 |
Temperature 3 | −10 | 86 |