Next Article in Journal
Study of the Relationships between the Spatial Extent of Surface Urban Heat Islands and Urban Characteristic Factors Based on Landsat ETM+ Data
Next Article in Special Issue
A Reduced Three Dimensional Model for SAW Sensors Using Finite Element Analysis
Previous Article in Journal
Intracerebroventricular Administration of Amyloid β-protein Oligomers Selectively Increases Dorsal Hippocampal Dialysate Glutamate Levels in the Awake Rat
Previous Article in Special Issue
Nano-Scale Characterization of a Piezoelectric Polymer (Polyvinylidene Difluoride, PVDF)
 
 

Order Article Reprints

Journal: Sensors, 2008
Volume: 8
Number: 7438

Article: Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer
Authors: by Azrul Azlan Hamzah, Jumril Yunas, Burhanuddin Yeop Majlis and Ibrahim Ahmad
Link: https://www.mdpi.com/1424-8220/8/11/7438

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop