Embedded Printing of Integrated Quantum Dot Waveguide Deformation Sensors
Abstract
1. Introduction
2. Materials and Methods
2.1. Measurement Principles and Sensor Concept
2.2. Manufacturing Process: Embedded Printing
2.2.1. Custom Printer Setup
2.2.2. Optical Carrier Material: Dowsil™ EI-1184
2.2.3. Quantum Dots: CdSe/CdS
2.2.4. Matrix Material: Copsil® Add-Gel
2.2.5. Sensor Sample Preparation
2.3. Characterization Methods
2.3.1. Attenuation Measurement
2.3.2. Deformation Experiments
3. Results
3.1. Attenuation Measurements
3.2. Sensor Characterization
4. Discussion
5. Conclusions and Outlook
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Biermann, T.; Mesecke, L.; Teves, S.; Eckert, G.; Hill, O.; Ziesche, I.; Wolf, A.; Lachmayer, R. Embedded Printing of Integrated Quantum Dot Waveguide Deformation Sensors. Sensors 2026, 26, 1160. https://doi.org/10.3390/s26041160
Biermann T, Mesecke L, Teves S, Eckert G, Hill O, Ziesche I, Wolf A, Lachmayer R. Embedded Printing of Integrated Quantum Dot Waveguide Deformation Sensors. Sensors. 2026; 26(4):1160. https://doi.org/10.3390/s26041160
Chicago/Turabian StyleBiermann, Tobias, Lennart Mesecke, Simon Teves, Gerrit Eckert, Ole Hill, Ivo Ziesche, Alexander Wolf, and Roland Lachmayer. 2026. "Embedded Printing of Integrated Quantum Dot Waveguide Deformation Sensors" Sensors 26, no. 4: 1160. https://doi.org/10.3390/s26041160
APA StyleBiermann, T., Mesecke, L., Teves, S., Eckert, G., Hill, O., Ziesche, I., Wolf, A., & Lachmayer, R. (2026). Embedded Printing of Integrated Quantum Dot Waveguide Deformation Sensors. Sensors, 26(4), 1160. https://doi.org/10.3390/s26041160

