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Journal: Sensors, 2026
Volume: 26
Number: 5525
5525
Article: Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments
Authors: by Zan Liu, Weijun Tong, Feng Wang, Qianfeng He, Shuhui Liu, Quanrong Deng, Wei Huang and Haoze Du
Link: https://www.mdpi.com/1424-8220/26/17/5525

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