Liu, Z.; Tong, W.; Wang, F.; He, Q.; Liu, S.; Deng, Q.; Huang, W.; Du, H.
Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments. Sensors 2026, 26, 5525.
https://doi.org/10.3390/s26175525
AMA Style
Liu Z, Tong W, Wang F, He Q, Liu S, Deng Q, Huang W, Du H.
Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments. Sensors. 2026; 26(17):5525.
https://doi.org/10.3390/s26175525
Chicago/Turabian Style
Liu, Zan, Weijun Tong, Feng Wang, Qianfeng He, Shuhui Liu, Quanrong Deng, Wei Huang, and Haoze Du.
2026. "Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments" Sensors 26, no. 17: 5525.
https://doi.org/10.3390/s26175525
APA Style
Liu, Z., Tong, W., Wang, F., He, Q., Liu, S., Deng, Q., Huang, W., & Du, H.
(2026). Dual-Layer Composite Packaged FBG Sensor Array with Enhanced Thermal and Bending Performance for Extreme Engineering Environments. Sensors, 26(17), 5525.
https://doi.org/10.3390/s26175525
