Veske-Lepp, P.; Van Steenkiste, G.; Thienpondt, S.; Cools, J.; De Pauw, H.; Bossuyt, F.
Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon. Sensors 2025, 25, 414.
https://doi.org/10.3390/s25020414
AMA Style
Veske-Lepp P, Van Steenkiste G, Thienpondt S, Cools J, De Pauw H, Bossuyt F.
Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon. Sensors. 2025; 25(2):414.
https://doi.org/10.3390/s25020414
Chicago/Turabian Style
Veske-Lepp, Paula, Glenn Van Steenkiste, Svea Thienpondt, Joris Cools, Herbert De Pauw, and Frederick Bossuyt.
2025. "Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon" Sensors 25, no. 2: 414.
https://doi.org/10.3390/s25020414
APA Style
Veske-Lepp, P., Van Steenkiste, G., Thienpondt, S., Cools, J., De Pauw, H., & Bossuyt, F.
(2025). Development of 3D-Formed Textile-Based Electrodes with Flexible Interconnect Ribbon. Sensors, 25(2), 414.
https://doi.org/10.3390/s25020414