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Journal: Sensors, 2024
Volume: 24
Number: 171
Article:
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging
Authors:
by
Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao and Daquan Yu
Link:
https://www.mdpi.com/1424-8220/24/1/171
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