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Journal: Sensors, 2024
Volume: 24
Number: 171

Article: Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging
Authors: by Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao and Daquan Yu
Link: https://www.mdpi.com/1424-8220/24/1/171

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