Order Article Reprints

Xu P, Si C, He Y, Wei Z, Jia L, Han G, Ning J, Yang F. A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging. Sensors. 2021; 21(19):6428. https://doi.org/10.3390/s21196428

Xu, Pengfei, Chaowei Si, Yurong He, Zhenyu Wei, Lu Jia, Guowei Han, Jin Ning, and Fuhua Yang. 2021. "A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging" Sensors 21, no. 19: 6428. https://doi.org/10.3390/s21196428

Xu, P., Si, C., He, Y., Wei, Z., Jia, L., Han, G., Ning, J., & Yang, F. (2021). A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging. Sensors, 21(19), 6428. https://doi.org/10.3390/s21196428