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Formation of Interstitial Hot-Spots Using the Reduced Gap-Size between Plasmonic Microbeads Pattern for Surface-Enhanced Raman Scattering Analysis

1
Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Korea
2
Department of Control and Instrumentation Engineering, Korea University, Sejong 30019, Korea
*
Author to whom correspondence should be addressed.
Sensors 2019, 19(5), 1046; https://doi.org/10.3390/s19051046
Received: 7 February 2019 / Revised: 21 February 2019 / Accepted: 21 February 2019 / Published: 1 March 2019
(This article belongs to the Special Issue SERS Sensing)
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Abstract

To achieve an effective surface-enhanced Raman scattering (SERS) sensor with periodically distributed “hot spots” on wafer-scale substrates, we propose a hybrid approach combining physical nano-imprint lithography and a chemical deposition method to form a silver microbead array. Nano-imprint lithography (NIL) can lead to mass-production and high throughput, but is not appropriate for generating strong “hot-spots.” However, when we apply electrochemical deposition to an NIL substrate and the reaction time was increased to 45 s, periodical “hot-spots” between the microbeads were generated on the substrates. It contributed to increasing the enhancement factor (EF) and lowering the detection limit of the substrates to 4.40 × 106 and 1.0 × 10−11 M, respectively. In addition, this synthetic method exhibited good substrate-to-substrate reproducibility (RSD < 9.4%). Our research suggests a new opportunity for expanding the SERS application. View Full-Text
Keywords: nano-imprint lithography; SERS; electrodeposition; nano patterning; gold; silver; nano-gap nano-imprint lithography; SERS; electrodeposition; nano patterning; gold; silver; nano-gap
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Lee, T.; Jung, S.; Kwon, S.; Kim, W.; Park, J.; Lim, H.; Lee, J. Formation of Interstitial Hot-Spots Using the Reduced Gap-Size between Plasmonic Microbeads Pattern for Surface-Enhanced Raman Scattering Analysis. Sensors 2019, 19, 1046.

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