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3D Imaging Based on Depth Measurement Technologies

by 1,†, 2,†, 3 and 1,*
Department of Electrical and Computer Engineering, Seoul National University, Gwanak-Gu Gwanakro 1, Seoul 08826, Korea
Jiangsu Key Laboratory of Spectral Imaging & Intelligent Sense, Nanjing University of Science and Technology, Nanjing 210094, China
Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam, Hong Kong, China
Author to whom correspondence should be addressed.
These authors contributed equally to this work.
Sensors 2018, 18(11), 3711;
Received: 3 September 2018 / Revised: 26 October 2018 / Accepted: 26 October 2018 / Published: 31 October 2018
(This article belongs to the Special Issue Depth Sensors and 3D Vision)
Three-dimensional (3D) imaging has attracted more and more interest because of its widespread applications, especially in information and life science. These techniques can be broadly divided into two types: ray-based and wavefront-based 3D imaging. Issues such as imaging quality and system complexity of these techniques limit the applications significantly, and therefore many investigations have focused on 3D imaging from depth measurements. This paper presents an overview of 3D imaging from depth measurements, and provides a summary of the connection between the ray-based and wavefront-based 3D imaging techniques. View Full-Text
Keywords: three-dimensional imaging; computational imaging; light field; holography; phase imaging three-dimensional imaging; computational imaging; light field; holography; phase imaging
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MDPI and ACS Style

Chen, N.; Zuo, C.; Lam, E.Y.; Lee, B. 3D Imaging Based on Depth Measurement Technologies. Sensors 2018, 18, 3711.

AMA Style

Chen N, Zuo C, Lam EY, Lee B. 3D Imaging Based on Depth Measurement Technologies. Sensors. 2018; 18(11):3711.

Chicago/Turabian Style

Chen, Ni, Chao Zuo, Edmund Y. Lam, and Byoungho Lee. 2018. "3D Imaging Based on Depth Measurement Technologies" Sensors 18, no. 11: 3711.

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