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Sensors 2016, 16(2), 267;

Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications

Department of Information Engineering, Electronics and Telecommunications, University of Rome, via Eudossiana 18, 00184 Rome, Italy
School of Aerospace Engineering, Sapienza University of Rome, via Salaria 851/881, 00138 Rome, Italy
Author to whom correspondence should be addressed.
Academic Editor: Vittorio M.N. Passaro
Received: 21 January 2016 / Revised: 9 February 2016 / Accepted: 16 February 2016 / Published: 20 February 2016
(This article belongs to the Section Physical Sensors)
Full-Text   |   PDF [3287 KB, uploaded 20 February 2016]   |  


This paper presents a thin film structure suitable for low-level radiation measurements in lab-on-chip systems that are subject to thermal treatments of the analyte and/or to large temperature variations. The device is the series connection of two amorphous silicon/amorphous silicon carbide heterojunctions designed to perform differential current measurements. The two diodes experience the same temperature, while only one is exposed to the incident radiation. Under these conditions, temperature and light are the common and differential mode signals, respectively. A proper electrical connection reads the differential current of the two diodes (ideally the photocurrent) as the output signal. The experimental characterization shows the benefits of the differential structure in minimizing the temperature effects with respect to a single diode operation. In particular, when the temperature varies from 23 to 50 °C, the proposed device shows a common mode rejection ratio up to 24 dB and reduces of a factor of three the error in detecting very low-intensity light signals. View Full-Text
Keywords: amorphous silicon sensors; lab-on-chip; differential photodiodes amorphous silicon sensors; lab-on-chip; differential photodiodes

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de Cesare, G.; Carpentiero, M.; Nascetti, A.; Caputo, D. Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications. Sensors 2016, 16, 267.

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