Next Article in Journal
Comprehensive Context Recognizer Based on Multimodal Sensors in a Smartphone
Next Article in Special Issue
Electromagnetically-Actuated Reciprocating Pump for High-Flow-Rate Microfluidic Applications
Previous Article in Journal
Species Discrimination among Three Kinds of Puffer Fish Using an Electronic Nose Combined with Olfactory Sensory Evaluation
 
 
Article

Modular Architecture of a Non-Contact Pinch Actuation Micropump

1
Faculty of Electrical Engineering, Universiti Teknologi Malaysia (UTM), 81310 Johor Bahru, Johor, Malaysia
2
Institute of Nanoelectronic Engineering, Universiti Malaysia Perlis (UniMAP), 01000 Kangar, Perlis, Malaysia
*
Author to whom correspondence should be addressed.
Sensors 2012, 12(9), 12572-12587; https://doi.org/10.3390/s120912572
Received: 13 July 2012 / Revised: 18 August 2012 / Accepted: 28 August 2012 / Published: 13 September 2012
(This article belongs to the Special Issue Microfluidic Devices)
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0–5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0–80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. View Full-Text
Keywords: electromagnetic micropump; diffuser; lab on chip; hot embossing electromagnetic micropump; diffuser; lab on chip; hot embossing
Show Figures

MDPI and ACS Style

Chee, P.S.; Arsat, R.; Adam, T.; Hashim, U.; Rahim, R.A.; Leow, P.L. Modular Architecture of a Non-Contact Pinch Actuation Micropump. Sensors 2012, 12, 12572-12587. https://doi.org/10.3390/s120912572

AMA Style

Chee PS, Arsat R, Adam T, Hashim U, Rahim RA, Leow PL. Modular Architecture of a Non-Contact Pinch Actuation Micropump. Sensors. 2012; 12(9):12572-12587. https://doi.org/10.3390/s120912572

Chicago/Turabian Style

Chee, Pei Song, Rashidah Arsat, Tijjani Adam, Uda Hashim, Ruzairi Abdul Rahim, and Pei Ling Leow. 2012. "Modular Architecture of a Non-Contact Pinch Actuation Micropump" Sensors 12, no. 9: 12572-12587. https://doi.org/10.3390/s120912572

Find Other Styles

Article Access Map by Country/Region

1
Only visits after 24 November 2015 are recorded.
Back to TopTop