Takamatsu, S.; Takano, H.; Binh-Khiem, N.; Takahata, T.; Iwase, E.; Matsumoto, K.; Shimoyama, I.
Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors. Sensors 2010, 10, 5888-5898.
https://doi.org/10.3390/s100605888
AMA Style
Takamatsu S, Takano H, Binh-Khiem N, Takahata T, Iwase E, Matsumoto K, Shimoyama I.
Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors. Sensors. 2010; 10(6):5888-5898.
https://doi.org/10.3390/s100605888
Chicago/Turabian Style
Takamatsu, Seiichi, Hisanori Takano, Nguyen Binh-Khiem, Tomoyuki Takahata, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama.
2010. "Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors" Sensors 10, no. 6: 5888-5898.
https://doi.org/10.3390/s100605888
APA Style
Takamatsu, S., Takano, H., Binh-Khiem, N., Takahata, T., Iwase, E., Matsumoto, K., & Shimoyama, I.
(2010). Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors. Sensors, 10(6), 5888-5898.
https://doi.org/10.3390/s100605888
