Santos, R.F.; Oliveira, B.M.C.; Savaris, L.C.G.; Ferreira, P.J.; Vieira, M.F.
Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects. Int. J. Mol. Sci. 2022, 23, 1891.
https://doi.org/10.3390/ijms23031891
AMA Style
Santos RF, Oliveira BMC, Savaris LCG, Ferreira PJ, Vieira MF.
Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects. International Journal of Molecular Sciences. 2022; 23(3):1891.
https://doi.org/10.3390/ijms23031891
Chicago/Turabian Style
Santos, Rúben F., Bruno M. C. Oliveira, Liliane C. G. Savaris, Paulo J. Ferreira, and Manuel F. Vieira.
2022. "Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects" International Journal of Molecular Sciences 23, no. 3: 1891.
https://doi.org/10.3390/ijms23031891
APA Style
Santos, R. F., Oliveira, B. M. C., Savaris, L. C. G., Ferreira, P. J., & Vieira, M. F.
(2022). Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects. International Journal of Molecular Sciences, 23(3), 1891.
https://doi.org/10.3390/ijms23031891