Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive
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Chen, L.; Khan, S.B.; Zhang, Z.; Wang, W. Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules 2025, 30, 4043. https://doi.org/10.3390/molecules30204043
Chen L, Khan SB, Zhang Z, Wang W. Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules. 2025; 30(20):4043. https://doi.org/10.3390/molecules30204043
Chicago/Turabian StyleChen, Limin, Sadaf Bashir Khan, Zhengjun Zhang, and Weipeng Wang. 2025. "Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive" Molecules 30, no. 20: 4043. https://doi.org/10.3390/molecules30204043
APA StyleChen, L., Khan, S. B., Zhang, Z., & Wang, W. (2025). Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules, 30(20), 4043. https://doi.org/10.3390/molecules30204043