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Article

Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive

1
Key Laboratory of Testing Technology for Manufacturing Process, School of Manufacturing Science and Engineering, Ministry of Education, Southwest University of Science and Technology, Mianyang 621010, China
2
Beijing Santel Technology & Trading Corp, Beijing 100854, China
3
Key Laboratory of Advanced Materials, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
*
Authors to whom correspondence should be addressed.
These authors contributed equally to this work.
Molecules 2025, 30(20), 4043; https://doi.org/10.3390/molecules30204043
Submission received: 18 August 2025 / Revised: 26 September 2025 / Accepted: 5 October 2025 / Published: 10 October 2025
(This article belongs to the Special Issue Photoelectrochemical Properties of Nanostructured Thin Films)

Abstract

In this study, we present a novel high-thermal-conductivity-organosilicon potting adhesive developed for use in power modules. The adhesive is designed to enhance power modules’ thermal properties and mechanical strength, addressing the need for more efficient and reliable encapsulation materials in electronic applications. By optimizing the resin formulation, the adhesive exhibits improved tensile strength and elongation at break properties, making it particularly suitable for applications requiring high durability and resilience under thermal and mechanical stress. Herein, we propose a high-thermal-conductivity organosilicon electronic potting adhesive designed for power modules. The adhesive consists of two components: Component A and Component B. Component A is composed of a base polymer (0.5–10 parts), silicone resin (0.15–10 parts), plasticizer (0.5–5 parts), color paste (0.01–0.2 parts), thermally conductive filler (70–120 parts), filler treatment agent (2–8 parts), and a catalyst (0.1–2 parts). Component B includes a base polymer (0.5–10 parts), silicone resin (0.15–10 parts), plasticizer (0.5–5 parts), thermally conductive filler (70–120 parts), crosslinking agent (0.1–10 parts), chain extender (0.1–10 parts), and crosslinking inhibitor (0.01–1 part). The adhesive is designed to improve the tensile strength and elongation at break. These materials were engineered to facilitate easy repair and disassembly, ensuring cost-effective maintenance and reuse in power module systems. This work demonstrates the potential of the adhesive in advancing the performance and longevity of power electronics, providing valuable insights into its practical application for high-performance electronic devices.
Keywords: organosilicon; adhesive; thermal conductivity; power modules; tensile strength; resin organosilicon; adhesive; thermal conductivity; power modules; tensile strength; resin

Share and Cite

MDPI and ACS Style

Chen, L.; Khan, S.B.; Zhang, Z.; Wang, W. Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules 2025, 30, 4043. https://doi.org/10.3390/molecules30204043

AMA Style

Chen L, Khan SB, Zhang Z, Wang W. Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules. 2025; 30(20):4043. https://doi.org/10.3390/molecules30204043

Chicago/Turabian Style

Chen, Limin, Sadaf Bashir Khan, Zhengjun Zhang, and Weipeng Wang. 2025. "Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive" Molecules 30, no. 20: 4043. https://doi.org/10.3390/molecules30204043

APA Style

Chen, L., Khan, S. B., Zhang, Z., & Wang, W. (2025). Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive. Molecules, 30(20), 4043. https://doi.org/10.3390/molecules30204043

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