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Entropy
Volume 20
Issue 6
10.3390/e20060447
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Article

Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis

by
Yubing Huang
1,
Wei Dai
1,*,
Lianxi Liu
2 and
Yu Zhao
1
1
School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China
2
Beijing Xinghang Mechanical-Electrical Equipment Co., Beijing 10091, China
*
Author to whom correspondence should be addressed.
Entropy 2018, 20(6), 447; https://doi.org/10.3390/e20060447
Submission received: 17 April 2018 / Revised: 1 June 2018 / Accepted: 4 June 2018 / Published: 7 June 2018
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Abstract

During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product.
Keywords: assembly process; screening evaluation; defect stream; stress-strength model; entropy assembly process; screening evaluation; defect stream; stress-strength model; entropy

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MDPI and ACS Style

Huang, Y.; Dai, W.; Liu, L.; Zhao, Y. Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis. Entropy 2018, 20, 447. https://doi.org/10.3390/e20060447

AMA Style

Huang Y, Dai W, Liu L, Zhao Y. Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis. Entropy. 2018; 20(6):447. https://doi.org/10.3390/e20060447

Chicago/Turabian Style

Huang, Yubing, Wei Dai, Lianxi Liu, and Yu Zhao. 2018. "Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis" Entropy 20, no. 6: 447. https://doi.org/10.3390/e20060447

APA Style

Huang, Y., Dai, W., Liu, L., & Zhao, Y. (2018). Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis. Entropy, 20(6), 447. https://doi.org/10.3390/e20060447

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