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Feature Paper
Article

12 Citations

5,679 Views

17 Pages

Micro Vacuum Chuck and Tensile Test System for Bio-Mechanical Evaluation of 3D Tissue Constructed of Human Induced Pluripotent Stem Cell-Derived Cardiomyocytes (hiPS-CM)

Kaoru Uesugi,
Fumiaki Shima,
Ken Fukumoto,
Ayami Hiura,
Yoshinari Tsukamoto,
Shigeru Miyagawa,
Yoshiki Sawa,
Takami Akagi,
Mitsuru Akashi and
Keisuke Morishima

Micromachines2019, 10(7), 487;https://doi.org/10.3390/mi10070487

19 July 2019

In this report, we propose a micro vacuum chuck (MVC) which can connect three-dimensional (3D) tissues to a tensile test system by vacuum pressure. Because the MVC fixes the 3D tissue by vacuum pressure generated on multiple vacuum holes, it is expec...

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Article

3 Citations

4,372 Views

14 Pages

On-Machine Measurement for Surface Flatness of Transparent and Thin Film in Laser Ablation Process

HyungTae Kim,
Yoon Jae Moon,
Heuiseok Kang and
Jun Yong Hwang

Coatings2020, 10(9), 885;https://doi.org/10.3390/coatings10090885

14 September 2020

In printed electronics, laser ablation is used to repair defective patterns on transparent, flexible, and thin films, using high-power lasers. The distance between the film surface and laser focus is sensitive to changes as the narrow focus depth of...

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Article

11 Citations

14,282 Views

10 Pages

On-Wafer Temperature Monitoring Sensor for Condition Monitoring of Repaired Electrostatic Chuck

Jae-Hwan Kim,
Yoonsung Koo,
Wansoo Song and
Sang Jeen Hong

Electronics2022, 11(6), 880;https://doi.org/10.3390/electronics11060880

10 March 2022

The temperature of electrostatic chuck (ESC), a wafer susceptor used in semiconductor etch equipment, must accurately control the temperature of wafers during the etching process to obtain uniform and consistent process results. Failure to control th...

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Article

1 Citations

3,391 Views

16 Pages

Development of Wafer-Type Plasma Monitoring Sensor with Automated Robot Arm Transfer Capability for Two-Dimensional In Situ Processing Plasma Diagnosis

Haewook Park,
Juhyun Kim,
Sungwon Cho,
Kyunghyun Kim,
Sungho Jang,
Younsok Choi and
Hohyun Lee

Sensors2024, 24(6), 1786;https://doi.org/10.3390/s24061786

10 March 2024

In this work, we propose our newly developed wafer-type plasma monitoring sensor based on a floating-type double probe method that can be useful for two-dimensional (2D) in situ plasma diagnosis within a semiconductor processing chamber. A key achiev...

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