Search Results (3)

Phenylethynyl-terminated imide (PETI) oligomers are highly valued for their diverse applications in films, moldings, adhesives, and composite material matrices. PETIs can be synthesized at varying molecular weights, enabling the fine-tuning of their properties to meet specific application requirements. Upon thermal curing, these oligomers form super-rigid network structures that enhance solvent resistance, increase glass-transition temperatures, and improve elastic moduli. Their low molecular weights and melt viscosities further facilitate processing, making them particularly suitable for composites and adhesive bonding. This review examines recent advancements in developing ultra-high-temperature PETIs, focusing on their structure–processing–properties relationships. It begins with an overview of the historical background and key physicochemical characteristics of PETIs, followed by a detailed discussion of PETIs synthesized from monomers featuring noncoplanar configurations (including kink and cardo structures), fluorinated groups, flexible linkages, and liquid crystalline mesogenic structures. The review concludes by addressing current challenges in this research field and exploring potential future directions. Full article

Modified phenylethynyl terminated polyimides (PIs) were successfully prepared by using neodymium oxide (Nd₂O₃) via high-speed stirring and ultrasonic dispersion methods. In addition, the structure and properties of the Nd₂O₃-modified imide oligomers as well as the thermo-oxidative stability of the modified polyimides (PI/Nd₂O₃ hybrid) and its modification mechanism were investigated in detail. The thermogravimetric analysis (TGA) results indicated that the 5% decomposition temperature (Td5%) of the PI/Nd₂O₃ hybrids improved from 557 °C to 575 °C, which was also verified by the TGA-IR tests. Meanwhile, the weight loss rate of the PI/Nd₂O₃ hybrids significantly decreased by 28% to 31% compared to that of pure PI under isothermal aging at 350 °C for 450 h when the added content of Nd₂O₃ was between 0.4 wt% and 1 wt%, showing outstanding thermo-oxidative stability. Moreover, the mechanism of the enhanced thermo-oxidative stability for the modified PIs was analyzed by scanning electron microscopy (SEM) and X-ray diffraction (XRD). Full article

Phenylethynyl-terminated aromatic polyimides meet requirements of resin transfer molding (RTM) and exhibits high glass transition temperature (T_g) were prepared. Moreover, the relationship between the polyimide backbones structure and their melting stability was investigated. The phenylethynyl-terminated polyimides were based on 4,4′-(hexafluorosiopropylidene)-diphthalic anhydride (6FDA) and different diamines of 3,4′-oxydianiline (3,4′-ODA), m-phenylenediamine (m-PDA) and 2,2′-bis(trifluoromethyl)benzidine (TFDB) were prepared. These oligoimides exhibit excellent melting flowability with wide processing temperature window and low minimum melt viscosities (<1 Pa·s). Two of the oligoimides display good melting stability at 280–290 °C, which meet the requirements of resin transfer molding (RTM) process. After thermally cured, all resins show high glass transition temperatures (T_gs, 363–391 °C) and good tensile strength (51–66 MPa). The cure kinetics studied by the differential scanning calorimetry (DSC), ¹³C nuclear magnetic resonance (¹³C NMR) characterization and density functional theory (DFT) definitely confirmed that the electron-withdrawing ability of oligoimide backbone can tremendously affect the curing reactivity of terminated phenylethynyl groups. The replacement of 3,4′-ODA units by m-PDA or TFDB units increase the electron-withdrawing ability of the backbone, which increase the curing rate of terminated phenylethynyl groups at processing temperatures, hence results in the worse melting stability. Full article