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Keywords = active photonic interposer

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10 pages, 3842 KB  
Article
Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer
by Qi Zheng, Haiyun Xue, Fengman Liu, Liqiang Cao, Qidong Wang, Huimin He, Fengwei Dai and Peng Sun
Processes 2022, 10(11), 2342; https://doi.org/10.3390/pr10112342 - 10 Nov 2022
Cited by 2 | Viewed by 6308
Abstract
The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high [...] Read more.
The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and evaluated. The problem of the co-fabrication of the TSV and edge coupler was solved, and perfect electrical and optical characteristics were also achieved. Finally, the fabrication of the substrate and the assembly of the 3D optical module were completed. This paper lays a solid foundation for the further research and large-scale application of 3D optical modules in the future. Full article
(This article belongs to the Section Automation Control Systems)
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