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Keywords = ZrAlOx-PVP

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Article
Low-Temperature ZrAlOx-PVP Hybrid Dielectrics with Crosslinking-Regulated Leakage Suppression for Flexible IGZO TFTs
by Yufei Yue, Honglong Ning, Xuecong Fang, Dongxiang Luo, Chi Yuan, Haitao Zhu, Xu Zhou, Xiaojie Li, Weiguang Xie, Rihui Yao and Junbiao Peng
Inorganics 2026, 14(6), 161; https://doi.org/10.3390/inorganics14060161 - 12 Jun 2026
Abstract
Flexible oxide electronics require dielectric layers that combine low-temperature processability, low leakage current, high capacitance density, and mechanical reliability. In this work, we prepared ZrAlOx-PVP hybrid dielectric films through a low-temperature self-combustion solution process at 180 °C and systematically investigated the [...] Read more.
Flexible oxide electronics require dielectric layers that combine low-temperature processability, low leakage current, high capacitance density, and mechanical reliability. In this work, we prepared ZrAlOx-PVP hybrid dielectric films through a low-temperature self-combustion solution process at 180 °C and systematically investigated the effect of PVP doping (0–2 wt%). The results show that PVP promotes the formation of M-O-C related bonding environments, suggesting the construction of an organic–inorganic crosslinked structure. Moderate PVP incorporation effectively suppresses leakage pathways, whereas excessive PVP induces polymer aggregation and trap-assisted conduction. Among all samples, the film on flexible PI (polyimide) with a PVP doping concentration of 0.5 wt% exhibits the best overall performance, with a leakage current as low as 1.89 × 10−8 A/cm2 at 1 MV/cm, a dielectric constant of 8.88. After static bending at a radius of 20 mm, the film maintains stable dielectric behavior, indicating improved stress tolerance. Flexible IGZO TFT fabricated with the optimized dielectric shows a mobility of 11.84 cm2 V−1 s−1, a threshold voltage of 0.48 V, and a subthreshold swing of 0.24 V dec−1 before bending. This work demonstrates that moderate PVP crosslinking provides an effective balance between defect suppression and stress relaxation, offering a practical interface-engineering strategy for low-temperature flexible high-k dielectrics. Full article
(This article belongs to the Special Issue Multifunctional Composites and Hybrid Materials)
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