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Keywords = MMICs automatic test

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13 pages, 4785 KB  
Article
MMIC on-Wafer Test Method Based on Hybrid Balanced and Unbalanced RF Pad Structures
by Yue Bian, Yifan Gu, Xu Ding, Zhiyu Wang, Jiongjiong Mo and Faxin Yu
Electronics 2018, 7(9), 208; https://doi.org/10.3390/electronics7090208 - 19 Sep 2018
Cited by 1 | Viewed by 5715
Abstract
Nowadays, more and more MMICs (Microwave Monolithic Integrated Circuit), such as limiters and switches, are designed to have balanced and unbalanced test pad structures to solve the challenging size restrictions and integration requirements for MMICs. Hybrid balanced and unbalanced RF (Radio Frequency) probes [...] Read more.
Nowadays, more and more MMICs (Microwave Monolithic Integrated Circuit), such as limiters and switches, are designed to have balanced and unbalanced test pad structures to solve the challenging size restrictions and integration requirements for MMICs. Hybrid balanced and unbalanced RF (Radio Frequency) probes are adopted for an on-wafer test of the heteromorphy structures. The thru standard based on single balanced or unbalanced structures cannot meet the impedance matching requirements of the hybrid RF probes at the same time, which leads to a dramatic decreasing of the calibration accuracy and cannot satisfy the requirement of MMIC test. Therefore, in this paper, the calibration error estimating of hybrid RF probes based on traditional SOLR (Short Open Load Reciprocal) calibration method is performed, and an on-wafer test approach of MMIC based on hybrid balanced and unbalanced RF probes is proposed which combines the OSL (Open Short Load) second-order de-embedding technique with vector error correction and the matrix transformation technique. The calibration reference plane can be accurately shifted to the probe tip with this method, which greatly improves the test accuracy, and an automatic test system is built for this method based on the object-oriented C# language. Full article
(This article belongs to the Special Issue Nano-materials Based 3D Electronics)
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18 pages, 10314 KB  
Article
All-in-One Wafer-Level Solution for MMIC Automatic Testing
by Xu Ding, Zhiyu Wang, Jiarui Liu, Min Zhou, Wei Chen, Hua Chen, Jiongjiong Mo and Faxin Yu
Electronics 2018, 7(5), 57; https://doi.org/10.3390/electronics7050057 - 26 Apr 2018
Cited by 2 | Viewed by 7488
Abstract
In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the calibration verification model, the accurate PAE (power added efficiency) testing, and the optimized vector cold source NF [...] Read more.
In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the calibration verification model, the accurate PAE (power added efficiency) testing, and the optimized vector cold source NF (noise figure) measurement techniques are integrated in this solution to improve the measurement accuracy. A dual-core topology formed by an IPC (industrial personal computer) and a VNA (vector network analyzer), and an automatic test software based on a three-level driver architecture, are applied to enhance the test efficiency. The benefit from this solution is that all the data of a MMIC can be achieved in only one contact, which shows state-of-the-art accuracy and efficiency. Full article
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