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Keywords = ENEPIG substrate

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18 pages, 9140 KB  
Article
Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish
by Panwang Chi, Yesu Li, Hongfa Pan, Yibo Wang, Nancheng Chen, Ming Li and Liming Gao
Materials 2021, 14(24), 7874; https://doi.org/10.3390/ma14247874 - 19 Dec 2021
Cited by 11 | Viewed by 6373
Abstract
Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high [...] Read more.
Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high impedance and weldability. In this paper, the interfacial reaction process between ultrathin ENEPIG substrates with different Ni layer thicknesses (0.112 and 0.185 μm) and Sn–3.0Ag–0.5Cu (SAC305) solder during reflow and aging was studied. The bonding ability and reliability of solder joints with different surface finishes were evaluated based on solder ball shear test, drop test and temperature cycle test (TCT), and the failure mechanism was analyzed from the perspective of intermetallic compound (IMC) interface growth. The results showed that the Ni–Sn–P layer generated by ultrathin ENEPIG can inhibit the growth of brittle IMC so that the solder joints maintain high shear strength. Ultrathin ENEPIG with a Ni layer thickness of 0.185 μm had no failure cracks under thermal cycling and drop impact, which can meet actual reliability standards. Therefore, ultrathin ENEPIG has broad prospects and important significance in the field of high-frequency chip substrate design and manufacturing. Full article
(This article belongs to the Special Issue Surface Functionalization Processes for New Multifunctional Materials)
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13 pages, 7982 KB  
Article
Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates
by Zhimin Liang, Fei Shen, Zongyuan Yang, Da Xu, Shaowei Wei, Zhenzhen Peng, Liwei Wang and Dianlong Wang
Metals 2021, 11(12), 2027; https://doi.org/10.3390/met11122027 - 14 Dec 2021
Cited by 4 | Viewed by 3667
Abstract
Sn–Sb system solders and ENIG/ENEPIG surface finish layers are commonly used in electronic products. To illustrate the thermal reliability evaluation of such solder joints, we studied the interfacial microstructure and shear properties of Sn-4.5Sb-3.5Bi-0.1Ag/ENIG and Sn-4.5Sb-3.5Bi-0.1Ag/ENEPIG solder joints after aging at 150 °C [...] Read more.
Sn–Sb system solders and ENIG/ENEPIG surface finish layers are commonly used in electronic products. To illustrate the thermal reliability evaluation of such solder joints, we studied the interfacial microstructure and shear properties of Sn-4.5Sb-3.5Bi-0.1Ag/ENIG and Sn-4.5Sb-3.5Bi-0.1Ag/ENEPIG solder joints after aging at 150 °C for 250, 500 and 1000 h. The results show that the intermetallic compound of Sn-4.5Sb-3.5Bi-0.1Ag/ENIG interface was more continuous and uniform compared with that of Sn-4.5Sb-3.5Bi-0.1Ag/ENEPIG interface after reflow. The thickness of the interfacial intermetallic compounds of the former was significantly thinner than that of the latter before and after aging. With extension of aging time, the former interface was stable, while obvious voids appeared at the interface of the latter after 500 h aging and significant fracture occurred after 1000 h aging. The shear tests proved that shear strength of solder joints decreased with increasing aging time. For the Sn-4.5Sb-3.5Bi-0.1Ag/ENEPIG joint after 1000 h aging, the fracture mode is ductile-brittle mixed type, which means fracture could occur at the solder matrix or the solder/IMC interface. For other samples of these two types of joints, ductile fracture occurred inside of the solder. The Sn-4.5Sb-3.5Bi-0.1Ag/ENIG solder joint was thermally more reliable than Sn-4.5Sb-3.5Bi-0.1Ag/ENEPIG. Full article
(This article belongs to the Special Issue Advances in Welding, Joining and Surface Coating Technology)
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