Acknowledgement to Reviewers of Microwave in 2025

The editors of Microwave extend their sincere thanks to every reviewer who assessed manuscripts for the journal in 2025. We are pleased to announce that Microwave, Volume 1, Issue 2 (September 2025), is now live at https://www.mdpi.com/3042-5697/1/2.

Rigorous peer review is the cornerstone of high-quality publishing; thanks to our reviewers, the median time to first decision in 2025 has been 19 days, and every accepted paper meets the journal’s standards. To turn gratitude into tangible support, we offer the following:

(i)

A publication discount for prompt, high-quality reports;

(ii)

Downloadable acknowledgement letters accessible through the reviewer’s account;

(iii)

Optional, confidentiality-compliant credit via MDPI’s partnership with Publons.

Reviewers repeatedly describe their work as voluntary and largely unseen service to the scientific community—we remain acutely aware of, and grateful for, the time and expertise they continue to share.

Regardless of whether the articles they examined were ultimately published, the editors would like to express their appreciation and thank the following reviewers for the time and dedication that they have shown to Microwave.

Name	Affiliation
Dr. Jinghua Ye	Chengdu University, China
Dr. Zhenfei Lv	Anhui University of Science & Technology (AUST), China
Dr. Ehsan Hosseini	University of Ottawa, Canada
Dr. Michal Borecki	Warsaw University of Technology, Poland
Dr. Giovanni Leone	University of Campania Luigi Vanvitelli, Italy
Dr. Victor Kagalovsky	Shamoon College of Engineering, Israel
Dr. Reza K. Amineh	New York Institute of Technology, United States
Dr. Niamat Hussain	Sejong University, Republic of Korea
Dr. Marcelo Perotoni	Federal University of ABC, Brazil
Dr. Chiang Liang Kok	University of Newcastle, Australia
Dr. Anatoliy Rinkevich	Ural Branch of the Russian Academy of Sciences, Russia
Dr. Ahmad Bazzi	New York University, United States
Dr. Filippo Laganà	University of Catanzaro, Italy
Dr. Giovanni Angiulli	Mediterranea University, Italy
Dr. Erick Reyes Vera	Instituto Tecnológico Metropolitano, Colombia