Next Article in Journal
A CMOS Voltage Reference with Output Voltage Doubling Using Modified 2T Topology
Previous Article in Journal
Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
 
 
Communication

Article Versions Notes

Chips 2022, 1(3), 210-217; https://doi.org/10.3390/chips1030014
Action Date Notes Link
article xml file uploaded 5 December 2022 13:11 CET Original file -
article xml uploaded. 5 December 2022 13:11 CET Update https://www.mdpi.com/2674-0729/1/3/14/xml
article pdf uploaded. 5 December 2022 13:11 CET Version of Record https://www.mdpi.com/2674-0729/1/3/14/pdf
article html file updated 5 December 2022 13:12 CET Original file -
article html file updated 4 March 2023 01:25 CET Update https://www.mdpi.com/2674-0729/1/3/14/html
Back to TopTop