A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes
Abstract
:1. Introduction
2. Materials and Methods
2.1. Manufacturing Facilities
2.2. Materials
2.3. Methodology
2.3.1. Determining the Effect of Defects
2.3.2. Workflow Implementation
2.4. Software
2.5. Testing and Statistics
3. Results
3.1. Effects of Defects
3.2. Process Flow to Account for Surface Defects
3.2.1. Conceptualizing the Process Chain
3.2.2. Testing the Process Flow
4. Discussion
5. Conclusions
- Global underextrusion due to excessive distance between the nozzle and the laminate in the order of the layer height leads to poor bonding;
- Local defects such as gaps and overlaps have no significant influence on bonding;
- Recording the real geometry and taking it into account in the path planning is essential for a stable process.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Property | TECACOMP PEEK 150 CF30 |
---|---|
Density/g/cm3 | 1.38 |
Young’s modulus/MPa | 17,500 |
Ultimate strength/MPa | 190 |
Nozzle temperature/°C | 400–440 |
Bed temperature/°C | 130–160 |
Parameter | Value |
---|---|
Nozzle temperature/°C | 420 |
Temperature of heating zone1/°C | 420 |
Temperature of heating zone2/°C | 420 |
Temperature of print bed/°C | 280 |
Ambient temperature/°C | 30 |
Printing speed/mm/s | 20 |
Layer height/mm | 0.6 |
Nozzle diameter/mm | 3.0 |
Laminate Defect | Effect on Overprinting | Tested Property |
---|---|---|
Gaps | Local underextrusion in the first layer | Bond strength parallel to the defect Bond strength perpendicular to the defect |
Overlaps | Local overextrusion in the first layer | Bond strength parallel to the defect Bond strength perpendicular to the defect |
Warpage/Waviness | Over-/underextruson in the first layer Over-/underextruson within 3D print | Bond strength at ±0.2 mm layer height error Inter-laminar strength of 3D print at ±0.2 mm layer height error |
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Atzler, F.; Hümbert, S.; Voggenreiter, H. A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes. J. Manuf. Mater. Process. 2024, 8, 147. https://doi.org/10.3390/jmmp8040147
Atzler F, Hümbert S, Voggenreiter H. A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes. Journal of Manufacturing and Materials Processing. 2024; 8(4):147. https://doi.org/10.3390/jmmp8040147
Chicago/Turabian StyleAtzler, Fynn, Simon Hümbert, and Heinz Voggenreiter. 2024. "A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes" Journal of Manufacturing and Materials Processing 8, no. 4: 147. https://doi.org/10.3390/jmmp8040147
APA StyleAtzler, F., Hümbert, S., & Voggenreiter, H. (2024). A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes. Journal of Manufacturing and Materials Processing, 8(4), 147. https://doi.org/10.3390/jmmp8040147