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Journal: J. Manuf. Mater. Process., 2018
Volume: 2
Number: 20

Article: Correlations between Thermal Loads during Grind-Hardening and Material Modifications Using the Concept of Process Signatures
Authors: by Benjamin Kolkwitz, Ewald Kohls, Carsten Heinzel and Ekkard Brinksmeier
Link: https://www.mdpi.com/2504-4494/2/1/20

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