Recent Advances in Ultrasonic Vibration-Assisted Machining of Ti-Al Intermetallic Compounds
Abstract
1. Characteristics of Ti-Al IMCs
2. Current Status of UVAM
3. Current Status of Research on the Machining Performance of Ti-Al IMCs
3.1. Current Status of Research on Cutting Forces
3.2. Current Status of Research on Cutting Temperature
3.3. Current Status of Research on Chip Morphology
3.4. Current Status of Research on Tool Wear
4. Current Status of Research on Surface Integrity of Ti-Al IMCs
4.1. Current Research Status on Surface Roughness
4.2. Current Research Status on Surface Defects
4.3. Current Status of Research on Surface Residual Stresses
4.4. Current Status of Research on Work Hardening
5. Conclusions and Outlook
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
Abbreviations
| Ti-Al IMCs | Ti-Al intermetallic compounds |
| UVAM | ultrasonic vibration-assisted machining |
| 1D | one-dimensional |
| 2D | two-dimensional |
| 3D | three-dimensional |
| UVAT | ultrasonic vibration-assisted turning |
| TWCR | tool-workpiece contact ratio |
| UAG | ultrasonic-assisted grinding |
| FEM | finite element modeling |
| CM | conventional milling |
| LUVAM | longitudinal ultrasonic vibration-assisted milling |
| CT | conventional turning |
| UAT | ultrasonic-assisted turning |
| LTUAG | longitudinal-torsional ultrasonic-assisted grinding |
| CFD | computational fluid dynamics |
| SEM | scanning electron microscopy |
| CG | conventional grinding |
| UVAG | ultrasonic vibration-assisted grinding |
| LTUVM | longitudinal-torsional ultrasonic vibration milling |
| UEVM | ultrasonic elliptical vibration machining |
| MQL | minimum quantity lubrication |
| EUAT | elliptical ultrasonic-assisted turning |
| LBVAM | longitudinal-bending vibration-assisted machining |
| RUEM | rotating ultrasonic elliptical machining |
| USRP | ultrasonic surface rolling peening |
| HUVC | high-speed ultrasonic vibration cutting |
| TEM | transmission electron microscopy |
| EBSD | electron backscatter diffraction |
| KAM | kernel average misorientation |
| UTVHM | ultrasonic transverse vibration-assisted helical milling |
| IPF | inverse pole figure |
| HM | helical milling |
| SLM | selective laser melting |
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| Performance | α2-Ti3Al | γ-TiAl | Ti2AlNb |
|---|---|---|---|
| Density/g·cm−3 | 4.15~4.9 | 3.76~3.9 | 5~5.8 |
| Elastic modulus/GPa | 95~115 | 160~180 | 102~134 |
| Yield strength/MPa | 700~1150 | 400~800 | 1030~1292 |
| Tensile strength/MPa | 750~1200 | 450~900 | 1245~1413 |
| Room temperature ductility/% | 2~10 | 1~4.2 | 3.5~10 |
| High temperature ductility/% | 10~20 (660 °C) | 10~60 (870 °C) | 6~14 (650 °C) |
| Fracture toughness/MPa·m1/2 | 12~80 | 12~35 | 39 |
| Oxidation resistance limit/°C | 649 | 800~950 | 1100 |
| Thermal conductivity/W·(m·K)−1 | 7 | 22~24 | 7.87 |
| Coefficient of expansion/·10−6 K−1 | 10 | 10.8 | 8.22 |
| Microstructures | ![]() | ![]() | ![]() |
| Machining Material and Method | Main Experimental/Simulation Conditions | Variation Law of Cutting Force | Main Reason or Mechanism | Researcher |
|---|---|---|---|---|
| Ti-45Al-8Nb-0.2C-0.2B; high-speed cutting | Cutting speed, feed rate, and depth of cut were varied | Depth of cut had the greatest influence on cutting force, followed by feed rate, while cutting speed had a relatively small effect | Increasing the depth of cut significantly increases the material removal cross-sectional area | Klocke et al. [82] |
| Ti-6Al-4V; ultrasonic-assisted turning | Vibration amplitude increased from 10 μm to 20 μm, and then to 30 μm | When the amplitude increased from 10 μm to 20 μm, the cutting force decreased by about 17% and the thrust force decreased by about 33%; when the amplitude further increased to 30 μm, the cutting force continued to decrease slightly | Increasing the amplitude enhances the intermittent tool-workpiece contact effect and reduces the average contact load | Patil et al. [84] |
| γ-TiAl intermetallic compound ultrasonic-assisted grinding | A grinding force model based on the single-abrasive-grain chip formation mechanism was established, considering the three stages of sliding, plowing, and chip formation | The grinding force decreased with increasing ultrasonic amplitude and frequency; when the amplitude increased from 10 μm to 30 μm, the cutting/grinding force decreased by about 28% | Ultrasonic vibration changes the motion trajectory of abrasive grains, reducing the undeformed chip thickness and contact load of a single abrasive grain | Li et al. [85] |
| α-Ti3Al micro-hole; longitudinal ultrasonic-assisted helical grinding | A grinding force model was established and experimentally verified; amplitude increased from 0 to 1.6 μm; spindle speed and feed rate were varied | When the amplitude increased from 0 to 1.6 μm, the planar grinding force decreased by 27.2%, the axial grinding force decreased by 28%, and the total grinding force decreased by 27.4%; increasing spindle speed reduced the grinding force, while increasing feed rate increased the grinding force | Ultrasonic vibration increases the instantaneous cutting speed of abrasive grains and reduces the chip cross-sectional area; increasing feed rate raises the material removal load | Gao et al. [86] |
| Machining Object/Material | Machining Method or Experimental Condition | Changes in Chip Morphology | Main Reason or Mechanism | Researcher |
|---|---|---|---|---|
| Ti2AlNb | Ultrasonic vibration-assisted milling | Chips became thinner and more uniform, with significantly reduced edge tearing | Ultrasonic vibration introduces a periodic tool-workpiece separation effect, thereby changing the chip formation mechanism | Wang et al. [99] |
| Inconel 718 | Ultrasonic vibration-assisted turning | Chips were relatively thinner, smoother, and longer | Ultrasonic vibration improves the cutting contact state and reduces the nonuniformity of chip deformation | Nath et al. [31] |
| Ti-6Al-4V | Ultrasonic vibration-assisted milling | Chips were thinner and shorter, with a more regular morphology | The tool-workpiece contact rate is reduced, and periodic separation changes the material removal process | Ni et al. [42] |
| Bio-ceramic materials | Ultrasonic vibration-assisted grinding | Chip size was significantly reduced, with an average size of approximately 0.05–0.07 mm | Ultrasonic vibration promotes micro-scale and intermittent material removal | Tesfay et al. [103] |
| Machining Parameter | Effect on Cutting Force | Effect on Cutting Temperature | Effect on Chip Morphology | Effect on Tool Wear |
|---|---|---|---|---|
| Cutting speed | Generally has a smaller effect than the cutting depth and feed rate; however, the force-reduction effect of UVAM decreases as the cutting speed increases. | Higher cutting or grinding speed tends to increase the temperature because of greater frictional and deformation heat. | High speed may reduce stable intermittent separation, leading to less-controlled chip segmentation. | At excessive speeds, tool-workpiece separation may disappear, increasing friction and wear; however, some ultrasonic modes can still reduce wear by lowering friction. |
| Feed rate | Increasing the feed rate usually increases the undeformed chip thickness and therefore the cutting force. | A higher feed rate can increase heat generation owing to the larger material removal load. | The chips became thicker and more difficult to control, and tearing and plastic flow became more apparent. | A greater mechanical load accelerates flank/rake face wear and may promote chipping. |
| Cutting depth | Has the most significant influence on cutting force among common cutting parameters; larger depth sharply increases force. | Larger cutting depth increases deformation work and heat accumulation in the cutting zone. | Produces thicker chips and may intensify tearing or unstable fracture. | Higher contact load increases abrasive, adhesive, and diffusion wear. |
| Vibration amplitude | Increasing amplitude within a proper range reduces force by enhancing intermittent contact; excessive amplitude may introduce impact load. | Moderate amplitude reduces average temperature through tool-workpiece separation; excessive amplitude may increase energy input and temperature. | Proper amplitude promotes chip segmentation, thinner chips, and reduced tearing; excessive amplitude may induce brittle fracture. | Suitable amplitude reduces adhesion and friction wear; excessive impact may cause edge chipping or coating damage. |
| Vibration frequency | Higher frequency can reduce grinding/cutting force by increasing periodic separation and reducing chip thickness. | Helps disperse heat and reduce local thermal concentration. | Promotes more regular chip formation and improved chip breaking. | Reduces average friction and adhesion, but the effect depends on vibration mode and tool coating stability. |
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Fu, Z.; Zhao, X.; Sun, H.; Jia, X. Recent Advances in Ultrasonic Vibration-Assisted Machining of Ti-Al Intermetallic Compounds. J. Manuf. Mater. Process. 2026, 10, 238. https://doi.org/10.3390/jmmp10070238
Fu Z, Zhao X, Sun H, Jia X. Recent Advances in Ultrasonic Vibration-Assisted Machining of Ti-Al Intermetallic Compounds. Journal of Manufacturing and Materials Processing. 2026; 10(7):238. https://doi.org/10.3390/jmmp10070238
Chicago/Turabian StyleFu, Zongxia, Xuansheng Zhao, Haichao Sun, and Xiaofeng Jia. 2026. "Recent Advances in Ultrasonic Vibration-Assisted Machining of Ti-Al Intermetallic Compounds" Journal of Manufacturing and Materials Processing 10, no. 7: 238. https://doi.org/10.3390/jmmp10070238
APA StyleFu, Z., Zhao, X., Sun, H., & Jia, X. (2026). Recent Advances in Ultrasonic Vibration-Assisted Machining of Ti-Al Intermetallic Compounds. Journal of Manufacturing and Materials Processing, 10(7), 238. https://doi.org/10.3390/jmmp10070238




