Next Article in Journal
A 0.18 μm CMOS Millimeter Wave Antenna-on-Chip with Artificial Magnetic Conductor Design
Next Article in Special Issue
Brain–Computer-Interface-Based Smart-Home Interface by Leveraging Motor Imagery Signals
Previous Article in Journal
The First Study of White Rust Disease Recognition by Using Deep Neural Networks and Raspberry Pi Module Application in Chrysanthemum
Previous Article in Special Issue
The Phasor Diagram of a Superconducting Synchronous Electrical Machine
 
 

Order Article Reprints

Journal: Inventions, 2023
Volume: 8
Number: 77

Article: Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs
Authors: by Maksim A. Korobkov, Fedor V. Vasilyev and Olga V. Khomutskaya
Link: https://www.mdpi.com/2411-5134/8/3/77

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop