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Journal: Inorganics, 2023
Volume: 11
Number: 204
Article:
Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
Authors:
by
Abdullah Aljaafari, Faheem Ahmed, Nagih M. Shaalan, Shalendra Kumar and Abdullah Alsulami
Link:
https://www.mdpi.com/2304-6740/11/5/204
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