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Journal: Inorganics, 2023
Volume: 11
Number: 204

Article: Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
Authors: by Abdullah Aljaafari, Faheem Ahmed, Nagih M. Shaalan, Shalendra Kumar and Abdullah Alsulami
Link: https://www.mdpi.com/2304-6740/11/5/204

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