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Journal: Processes, 2025
Volume: 13
Number: 63
63
Article: Design and Application of Wireless Wall Thickness Monitoring System for Ground Testing Process
Authors: by Yufa He, Yu Chen, Jianfei Wei, Zhong Li, Xingwang Guo, Renjun Xie, Ruiling Li, Jian Liu, Zhenxing Tan and Kexin Zhang
Link: https://www.mdpi.com/2227-9717/13/1/63

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