Order Article Reprints

Wang D, Mao X, Peng Y, Zhang W, Ye Q, Yang Y, Yu F, Ma Y, Wu A, Qi Z. Investigation of a Hydrophobic Sputtered Cu Electrode to Electrocatalyze CO₂ Towards a C₂⁺ Product: The Effect of Substrate and Catalyst Thickness. Processes. 2024; 12(11):2374. https://doi.org/10.3390/pr12112374

Wang, Dongdong, Xiaoyu Mao, Yaqi Peng, Wei Zhang, Qiulin Ye, Yan Yang, Fengping Yu, Yan Ma, Angjian Wu, and Zhifu Qi. 2024. "Investigation of a Hydrophobic Sputtered Cu Electrode to Electrocatalyze CO₂ Towards a C₂⁺ Product: The Effect of Substrate and Catalyst Thickness" Processes 12, no. 11: 2374. https://doi.org/10.3390/pr12112374

Wang, D., Mao, X., Peng, Y., Zhang, W., Ye, Q., Yang, Y., Yu, F., Ma, Y., Wu, A., & Qi, Z. (2024). Investigation of a Hydrophobic Sputtered Cu Electrode to Electrocatalyze CO₂ Towards a C₂⁺ Product: The Effect of Substrate and Catalyst Thickness. Processes, 12(11), 2374. https://doi.org/10.3390/pr12112374