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Journal: Processes, 2024
Volume: 12
Number: 2374
Article:
Investigation of a Hydrophobic Sputtered Cu Electrode to Electrocatalyze CO2 Towards a C2+ Product: The Effect of Substrate and Catalyst Thickness
Authors:
by
Dongdong Wang, Xiaoyu Mao, Yaqi Peng, Wei Zhang, Qiulin Ye, Yan Yang, Fengping Yu, Yan Ma, Angjian Wu and Zhifu Qi
Link:
https://www.mdpi.com/2227-9717/12/11/2374
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