Feng, Y.; Shi, Y.; Tian, Y.; Yang, Y.; Wang, J.; Guo, H.; Banitaba, S.N.; Khademolqorani, S.; Li, J.
The Collagen-Based Scaffolds for Bone Regeneration: A Journey through Electrospun Composites Integrated with Organic and Inorganic Additives. Processes 2023, 11, 2105.
https://doi.org/10.3390/pr11072105
AMA Style
Feng Y, Shi Y, Tian Y, Yang Y, Wang J, Guo H, Banitaba SN, Khademolqorani S, Li J.
The Collagen-Based Scaffolds for Bone Regeneration: A Journey through Electrospun Composites Integrated with Organic and Inorganic Additives. Processes. 2023; 11(7):2105.
https://doi.org/10.3390/pr11072105
Chicago/Turabian Style
Feng, Yashan, Yanhong Shi, Yafang Tian, Yongxin Yang, Jun Wang, Haiwei Guo, Seyedeh Nooshin Banitaba, Sanaz Khademolqorani, and Jing’an Li.
2023. "The Collagen-Based Scaffolds for Bone Regeneration: A Journey through Electrospun Composites Integrated with Organic and Inorganic Additives" Processes 11, no. 7: 2105.
https://doi.org/10.3390/pr11072105
APA Style
Feng, Y., Shi, Y., Tian, Y., Yang, Y., Wang, J., Guo, H., Banitaba, S. N., Khademolqorani, S., & Li, J.
(2023). The Collagen-Based Scaffolds for Bone Regeneration: A Journey through Electrospun Composites Integrated with Organic and Inorganic Additives. Processes, 11(7), 2105.
https://doi.org/10.3390/pr11072105
