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Journal: Processes, 2023
Volume: 11
Number: 627

Article: Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ΔE-E telescope
Authors: by Zhiyuan Zhu, Maoqiu Pu, Min Jiang, Sixiang Zhang and Min Yu
Link: https://www.mdpi.com/2227-9717/11/2/627

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