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Journal: Processes, 2023
Volume: 11
Number: 3300

Article: Ultrasonic Vibration-assisted Electrochemical Discharge Machining of Quartz Wafer Micro-Hole Arrays
Authors: by Chun-Hao Yang, Tai-Ching Wang, Jung-Chou Hung and Hai-Ping Tsui
Link: https://www.mdpi.com/2227-9717/11/12/3300

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