Zheng, Q.; Xue, H.; Liu, F.; Cao, L.; Wang, Q.; He, H.; Dai, F.; Sun, P.
Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer. Processes 2022, 10, 2342.
https://doi.org/10.3390/pr10112342
AMA Style
Zheng Q, Xue H, Liu F, Cao L, Wang Q, He H, Dai F, Sun P.
Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer. Processes. 2022; 10(11):2342.
https://doi.org/10.3390/pr10112342
Chicago/Turabian Style
Zheng, Qi, Haiyun Xue, Fengman Liu, Liqiang Cao, Qidong Wang, Huimin He, Fengwei Dai, and Peng Sun.
2022. "Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer" Processes 10, no. 11: 2342.
https://doi.org/10.3390/pr10112342
APA Style
Zheng, Q., Xue, H., Liu, F., Cao, L., Wang, Q., He, H., Dai, F., & Sun, P.
(2022). Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer. Processes, 10(11), 2342.
https://doi.org/10.3390/pr10112342