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Journal: Mathematics, 2022
Volume: 10
Number: 3055
Article:
Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process
Authors:
by
Yu Guo, Minghe Liu, Mingang Yin and Yutao Yan
Link:
https://www.mdpi.com/2227-7390/10/17/3055
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