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Journal: Mathematics, 2022
Volume: 10
Number: 3055

Article: Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process
Authors: by Yu Guo, Minghe Liu, Mingang Yin and Yutao Yan
Link: https://www.mdpi.com/2227-7390/10/17/3055

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