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Technologies 2016, 4(1), 8;

Droplet-Assisted Laser Direct Nanoscale Writing on Silicon

Department of Mechanical Engineering, National Yunlin University of Science and Technology, Douliou, Yunlin 640, Taiwan
Department of Mechanical Engineering, National Taipei University of Technology, Taipei 106, Taiwan
Author to whom correspondence should be addressed.
These authors contributed equally to this work.
This is an extended version of conference paper published in IEEE-NEMS 2014.
Academic Editor: Manoj Gupta
Received: 31 December 2015 / Revised: 25 January 2016 / Accepted: 19 February 2016 / Published: 2 March 2016
(This article belongs to the Special Issue Laser Percussion Drilling Technology)
Full-Text   |   PDF [17293 KB, uploaded 2 March 2016]   |  


Nano-structuring using laser direct writing technology has shown great potential for industrial applications. A novel application of water droplets to this technology is proposed in this paper. With a hydrophobic layer and a controlled substrate temperature, a layer of randomly distributed water droplets with a high contact angle is formed on the substrate. These liquid droplets can be used as lenses to enhance the laser intensity at the bottom of the droplets. As a result, nanoscale holes can be fabricated on the substrate by controlling the laser energy density. We successfully fabricated holes with a diameter of 600 nm at a substrate temperature of 12 C and a power density of 1.2 × 108 W/cm2 in our experiments. We also found that the hole diameter was around a ninth of the water droplet diameter. Meanwhile, the machined holes are not affected much by the focal length of the lens, but a hole with less than 100 nm in diameter at the center was observed. View Full-Text
Keywords: direct writing; laser; droplet; nanoscale direct writing; laser; droplet; nanoscale

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Chang, Y.-J.; Chang, C.-H.; Ho, C.-C.; Hsu, J.-C.; Kuo, C.-L. Droplet-Assisted Laser Direct Nanoscale Writing on Silicon. Technologies 2016, 4, 8.

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