Drilling of Copper Using a Dual-Pulse Femtosecond Laser
AbstractThe drilling of copper using a dual-pulse femtosecond laser with wavelength of 800 nm, pulse duration of 120 fs and a variable pulse separation time (0.1–150 ps) is investigated theoretically. A one-dimensional two-temperature model with temperature-dependent material properties is considered, including dynamic optical properties and the thermal-physical properties. Rapid phase change and phase explosion models are incorporated to simulate the material ablation process. Numerical results show that under the same total laser fluence of 4 J/cm2, a dual-pulse femtosecond laser with a pulse separation time of 30–150 ps can increase the ablation depth, compared to the single pulse. The optimum pulse separation time is 85 ps. It is also demonstrated that a dual pulse with a suitable pulse separation time for different laser fluences can enhance the ablation rate by about 1.6 times. View Full-Text
Share & Cite This Article
Cheng, C.-W.; Chen, J.-K. Drilling of Copper Using a Dual-Pulse Femtosecond Laser. Technologies 2016, 4, 7.
Cheng C-W, Chen J-K. Drilling of Copper Using a Dual-Pulse Femtosecond Laser. Technologies. 2016; 4(1):7.Chicago/Turabian Style
Cheng, Chung-Wei; Chen, Jinn-Kuen. 2016. "Drilling of Copper Using a Dual-Pulse Femtosecond Laser." Technologies 4, no. 1: 7.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.