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Journal: Aerospace, 2025
Volume: 12
Number: 770
Article:
Validation of PCB Strain-Based Methodology for Structural Design of Spaceborne Electronic Equipment Under Vertical Mounting Conditions in Launch Environments
Authors:
by
Jae-Cheol Hwang, Kwang-Woo Kim and Hyun-Ung Oh
Link:
https://www.mdpi.com/2226-4310/12/9/770
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