Order Article Reprints
Journal: Electronics, 2019
Volume: 8
Number: 974
Article:
A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors
Authors:
by
Jicong Zhao, Mingmin Ge, Chenguang Song, Ling Sun and Haiyan Sun
Link:
https://www.mdpi.com/2079-9292/8/9/974
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.