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Journal: Electronics, 2019
Volume: 8
Number: 974

Article: A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors
Authors: by Jicong Zhao, Mingmin Ge, Chenguang Song, Ling Sun and Haiyan Sun
Link: https://www.mdpi.com/2079-9292/8/9/974

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