Next Article in Journal
Modeling the Hysteresis Characteristics of Transformer Core under Various Excitation Level via On-Line Measurements
Next Article in Special Issue
Spectrum Values in Suburban/Urban Environments above 1.5 GHz
Previous Article in Journal
An Optimized Algorithm and Test Bed for Improvement of Efficiency of ESS and Energy Use
Previous Article in Special Issue
Development of a Bike-Sharing System Based on Pedal-Assisted Electric Bicycles for Bogota City
 
 
Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
Journals
Electronics
Volume 7
Issue 12
10.3390/electronics7120389
Order Reprints
electronics-logo
Submit to this Journal Review for this Journal Propose a Special Issue
► Article Menu

Article Menu

share Share announcement Help format_quote Cite question_answer Discuss in SciProfiles

Order Article Reprints

Journal: Electronics, 2018
Volume: 7
Number: 389

Article: Virtual Machine Placement via Bin Packing in Cloud Data Centers
Authors: by Aisha Fatima, Nadeem Javaid, Tanzeela Sultana, Waqar Hussain, Muhammad Bilal, Shaista Shabbir, Yousra Asim, Mariam Akbar and Manzoor Ilahi
Link: https://www.mdpi.com/2079-9292/7/12/389

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop