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Journal: Electronics, 2026
Volume: 15
Number: 121

Article: Junction Temperature and Failure Behavior of High-Power Press Pack vs. Module Diodes Under High Anomalous Surge Currents
Authors: by Fawad Ahmad, Luis Vaccaro, Armel Asongu Nkembi, Mario Marchesoni, Federico Portesine and Giulio Anyanwu
Link: https://www.mdpi.com/2079-9292/15/1/121

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