Chen, L.; Tang, L.; Ma, H.; Gu, W.; Liu, C.; Jia, X.; Tao, T.; Liu, S.; Chen, Y.; Wang, X.;
et al. Application of Highly Spatially Resolved Area Array Velocity Measurement in the Cracking Behavior of Materials. Electronics 2025, 14, 1732.
https://doi.org/10.3390/electronics14091732
AMA Style
Chen L, Tang L, Ma H, Gu W, Liu C, Jia X, Tao T, Liu S, Chen Y, Wang X,
et al. Application of Highly Spatially Resolved Area Array Velocity Measurement in the Cracking Behavior of Materials. Electronics. 2025; 14(9):1732.
https://doi.org/10.3390/electronics14091732
Chicago/Turabian Style
Chen, Long, Longhuang Tang, Heli Ma, Wei Gu, Cangli Liu, Xing Jia, Tianjiong Tao, Shenggang Liu, Yongchao Chen, Xiang Wang,
and et al. 2025. "Application of Highly Spatially Resolved Area Array Velocity Measurement in the Cracking Behavior of Materials" Electronics 14, no. 9: 1732.
https://doi.org/10.3390/electronics14091732
APA Style
Chen, L., Tang, L., Ma, H., Gu, W., Liu, C., Jia, X., Tao, T., Liu, S., Chen, Y., Wang, X., Wu, J., Li, C., & Weng, J.
(2025). Application of Highly Spatially Resolved Area Array Velocity Measurement in the Cracking Behavior of Materials. Electronics, 14(9), 1732.
https://doi.org/10.3390/electronics14091732
