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Journal: Electronics, 2025
Volume: 14
Number: 2286

Article: Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout
Authors: by Mohammed Abdel Razzaq, Michael Meilunas, Xian A. Cao, Jim Wilcox and Abdallah Ramini
Link: https://www.mdpi.com/2079-9292/14/11/2286

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