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Journal: Electronics, 2024
Volume: 13
Number: 3429
3429
Article: Schottky Barrier Formation Mechanism and Thermal Stability in Au-Free Cu/Metal–Silicide Contacts to GaN-Cap/AlGaN/AlN-Spacer/GaN-on-Si Heterostructure
Authors: by Marek Wzorek, Marek Ekielski, Krzysztof Piskorski, Jarosław Tarenko, Michał A. Borysiewicz, Ernest Brzozowski and Andrzej Taube
Link: https://www.mdpi.com/2079-9292/13/17/3429

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