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Electronics
Volume 13
Issue 14
10.3390/electronics13142779
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Journal: Electronics, 2024
Volume: 13
Number: 2779

Article: Impact of H-Related Chemical Bonds on Physical Properties of SiNx:H Films Deposited via Plasma-Enhanced Chemical Vapor Deposition
Authors: by Jianping Ning, Zhen Tang, Lunqian Chen, Bowen Li, Qidi Wu, Yue Sun and Dayu Zhou
Link: https://www.mdpi.com/2079-9292/13/14/2779

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