Huang, T.-J.; Kiebala, T.; Suflita, P.; Moore, C.; Housser, G.; McMahon, S.; Puchades, I.
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration. Electronics 2024, 13, 1818.
https://doi.org/10.3390/electronics13101818
AMA Style
Huang T-J, Kiebala T, Suflita P, Moore C, Housser G, McMahon S, Puchades I.
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration. Electronics. 2024; 13(10):1818.
https://doi.org/10.3390/electronics13101818
Chicago/Turabian Style
Huang, Tzu-Jung, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon, and Ivan Puchades.
2024. "Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration" Electronics 13, no. 10: 1818.
https://doi.org/10.3390/electronics13101818
APA Style
Huang, T.-J., Kiebala, T., Suflita, P., Moore, C., Housser, G., McMahon, S., & Puchades, I.
(2024). Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration. Electronics, 13(10), 1818.
https://doi.org/10.3390/electronics13101818