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Journal: Electronics, 2023
Volume: 12
Number: 1077
Article:
A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding
Authors:
by
Song Wang, Xiping Jiang, Fujun Bai, Wenwu Xiao, Xiaodong Long, Qiwei Ren and Yi Kang
Link:
https://www.mdpi.com/2079-9292/12/5/1077
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