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Journal: Electronics, 2023
Volume: 12
Number: 4403
Article:
Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices
Authors:
by
Tae Yeong Hong, Sarah Eunkyung Kim, Jong Kyung Park and Seul Ki Hong
Link:
https://www.mdpi.com/2079-9292/12/21/4403
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