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Journal: Electronics, 2023
Volume: 12
Number: 2799
Article:
Hardware in the Loop Simulation for Bottle Sealing Process Virtualized on Unity 3D
Authors:
by
Adrián Villarroel, Danny Toapanta, Santiago Naranjo and Jessica S. Ortiz
Link:
https://www.mdpi.com/2079-9292/12/13/2799
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